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3D system integration: interconnect requirements and processes

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T15:21:06Z
dc.date.available2021-10-18T15:21:06Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16746
dc.sourceIIOimport
dc.title3D system integration: interconnect requirements and processes
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
dc.source.conferencedate19/01/2010
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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