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Direction of microelectronics in chip packaging technology

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T15:21:10Z
dc.date.available2021-10-18T15:21:10Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16747
dc.sourceIIOimport
dc.titleDirection of microelectronics in chip packaging technology
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference14th Symposium on Polymers for Microelectronics
dc.source.conferencedate11/05/2010
dc.source.conferencelocationWilmington, DE USA
dc.identifier.urlhttp://www.symposiumonpolymers.com/
imec.availabilityPublished - imec


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