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Compact thermal modelling of hot spots in 3D-stacked ICs

dc.contributor.authorBeyne, Eric
dc.contributor.authorOprins, Herman
dc.date.accessioned2021-10-18T15:21:21Z
dc.date.available2021-10-18T15:21:21Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16749
dc.sourceIIOimport
dc.titleCompact thermal modelling of hot spots in 3D-stacked ICs
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.source.peerreviewno
dc.source.conferenceIMAPS Benelux Spring event - Thermal and Mechanical Challenges in Power Electronics
dc.source.conferencedate16/06/2010
dc.source.conferencelocationEindhoven Netherlands
imec.availabilityPublished - imec


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