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MEMS packaging and 3D interconnection

dc.contributor.authorBeyne, Eric
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-18T15:21:25Z
dc.date.available2021-10-18T15:21:25Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16750
dc.sourceIIOimport
dc.titleMEMS packaging and 3D interconnection
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conferencePackaging and Interconnection for Electronics and Sensors, Past Present and Future
dc.source.conferencedate10/02/2010
dc.source.conferencelocationCambridge UK
imec.availabilityPublished - imec


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