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Packaging of opto-electronic devices for flexible applications

dc.contributor.authorBosman, Erwin
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorVan Daele, Peter
dc.date.accessioned2021-10-18T15:24:31Z
dc.date.available2021-10-18T15:24:31Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16783
dc.sourceIIOimport
dc.titlePackaging of opto-electronic devices for flexible applications
dc.typeProceedings paper
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Daele, Peter
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Daele, Peter::0000-0003-0557-7741
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage76070G
dc.source.conferenceOptoelectronic Interconnects and Component Integration IX
dc.source.conferencedate25/01/2010
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 7607


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