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3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas

dc.contributor.authorBrebels, Steven
dc.contributor.authorMohammadpour-Aghdam, Karim
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVandenbosch, Guy
dc.date.accessioned2021-10-18T15:26:03Z
dc.date.available2021-10-18T15:26:03Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16797
dc.sourceIIOimport
dc.title3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas
dc.typeProceedings paper
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewyes
dc.source.beginpage1028
dc.source.endpage1031
dc.source.conferenceInternational Microwave Symposium - IMS
dc.source.conferencedate23/05/2010
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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