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A practical approach to thermal modeling and validation of 3D-ICs

dc.contributor.authorCupak, Miroslav
dc.contributor.authorOprins, Herman
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorMarchal, Pol
dc.contributor.authorVandevelde, Bart
dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCheng, Edmund
dc.date.accessioned2021-10-18T15:44:44Z
dc.date.available2021-10-18T15:44:44Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16925
dc.sourceIIOimport
dc.titleA practical approach to thermal modeling and validation of 3D-ICs
dc.typeMeeting abstract
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceDAC 2010 User Track
dc.source.conferencedate13/07/2010
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - open access


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