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3D heterogeneous integration techniques for wireless devices

dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBrebels, Steven
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T15:50:52Z
dc.date.available2021-10-18T15:50:52Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16960
dc.sourceIIOimport
dc.title3D heterogeneous integration techniques for wireless devices
dc.typeOral presentation
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceRFIC Symposium Workshop M: RF Packaging Solutions for Wireless Communication Platforms
dc.source.conferencedate23/05/2010
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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