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Processing aspects to achieve high-end hybrid backside illuminated imagers

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorDe Munck, Koen
dc.contributor.authorErismis, Mehmet Akif
dc.contributor.authorRamachandra Rao, Padmakumar
dc.contributor.authorMinoglou, Kiki
dc.contributor.authorZhang, Wenqi
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorDe Moor, Piet
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-18T15:53:45Z
dc.date.available2021-10-18T15:53:45Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16976
dc.sourceIIOimport
dc.titleProcessing aspects to achieve high-end hybrid backside illuminated imagers
dc.typeProceedings paper
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.conferenceIMAPS 43rd International Symposium on Microelectronics
dc.source.conferencedate31/10/2010
dc.source.conferencelocationRaleigh, NC USA
imec.availabilityPublished - imec


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