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Influence of the processing method on the amount and development of voids in miniaturized interconnections

dc.contributor.authorDimcic, Biljana
dc.contributor.authorLabie, Riet
dc.contributor.authorZhang, Wenqi
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVerlinden, Bert
dc.date.accessioned2021-10-18T16:04:26Z
dc.date.available2021-10-18T16:04:26Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17029
dc.sourceIIOimport
dc.titleInfluence of the processing method on the amount and development of voids in miniaturized interconnections
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.conferenceElectronics System Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2010
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - imec


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