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Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging

dc.contributor.authorDuval, Fabrice
dc.contributor.authorSoussan, Philippe
dc.contributor.authorMiller, Andy
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorSun, Xiao
dc.contributor.authorBeyne, Eric
dc.contributor.authorOkoro, Chukwudi
dc.date.accessioned2021-10-18T16:08:50Z
dc.date.available2021-10-18T16:08:50Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17050
dc.sourceIIOimport
dc.titleEvaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
dc.typeOral presentation
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference14th Symposium on Polymers for Microelectronics
dc.source.conferencedate11/05/2010
dc.source.conferencelocationWilmington, DE USA
imec.availabilityPublished - imec


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