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Ultra thin die embedding technology with 20um-pitch interconnection

dc.contributor.authorFunaya, Takuo
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDe Preter, Inge
dc.contributor.authorBeyne, Eric
dc.contributor.authorIker, Francois
dc.date.accessioned2021-10-18T16:25:51Z
dc.date.available2021-10-18T16:25:51Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17120
dc.sourceIIOimport
dc.titleUltra thin die embedding technology with 20um-pitch interconnection
dc.typeProceedings paper
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage1575
dc.source.endpage1580
dc.source.conferenceIEEE 60th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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