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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorBosman, Erwin
dc.contributor.authorChristiaens, Wim
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-18T16:41:16Z
dc.date.available2021-10-18T16:41:16Z
dc.date.issued2010
dc.identifier.issn1521-3323
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17179
dc.sourceIIOimport
dc.titleFine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
dc.typeJournal article
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage72
dc.source.endpage78
dc.source.journalIEEE Transactions on Advanced Packaging
dc.source.issue1
dc.source.volume33
imec.availabilityPublished - open access


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