Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

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Authors

Govaerts, Jonathan; Bosman, Erwin; Christiaens, Wim; Vanfleteren, Jan

ISSN

1521-3323

Issue

1

Journal

IEEE Transactions on Advanced Packaging

Volume

33

Title

Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

Publication type

Journal article

Embargo date

9999-12-31

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