Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology

dc.contributor.author	Govaerts, Jonathan
dc.contributor.author	Bosman, Erwin
dc.contributor.author	Christiaens, Wim
dc.contributor.author	Vanfleteren, Jan
dc.contributor.imecauthor	Govaerts, Jonathan
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.orcidimec	Govaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned	2021-10-18T16:41:16Z
dc.date.available	2021-10-18T16:41:16Z
dc.date.embargo	9999-12-31
dc.date.issued	2010
dc.identifier.issn	1521-3323
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/17179
dc.source.beginpage	72
dc.source.endpage	78
dc.source.issue	1
dc.source.journal	IEEE Transactions on Advanced Packaging
dc.source.volume	33
dc.title	Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
dc.type	Journal article
dspace.entity.type	Publication
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