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Ultra-fast in-line metrology for 3D SIC TSV line - Bonding & thinning

dc.contributor.authorGuittet, Pierre-Yves
dc.contributor.authorMarkwort, Lars
dc.contributor.authorSavage, Greg
dc.contributor.authorHalder, Sandip
dc.contributor.authorJourdain, Anne
dc.date.accessioned2021-10-18T16:46:32Z
dc.date.available2021-10-18T16:46:32Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17198
dc.sourceIIOimport
dc.titleUltra-fast in-line metrology for 3D SIC TSV line - Bonding & thinning
dc.typeMeeting abstract
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorJourdain, Anne
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage184
dc.source.endpage185
dc.source.conference10th International Symposium on Ultra Clean Processing of Semiconductor Interfaces - UCPSS
dc.source.conferencedate19/09/2010
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access


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