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Design and analysis of a novel fine pitch and highly stretchable interconnect

dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorAxisa, Fabrice
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-18T17:12:19Z
dc.date.available2021-10-18T17:12:19Z
dc.date.issued2010
dc.identifier.issn1356-5362
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17286
dc.sourceIIOimport
dc.titleDesign and analysis of a novel fine pitch and highly stretchable interconnect
dc.typeJournal article
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage33
dc.source.endpage38
dc.source.journalMicroelectronics International
dc.source.issue1
dc.source.volume27
imec.availabilityPublished - imec


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