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Design and analysis of a novel fine pitch and highly stretchable interconnect
Publication:
Design and analysis of a novel fine pitch and highly stretchable interconnect
Date
2010
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Hsu, Yung-Yu
;
Gonzalez, Mario
;
Bossuyt, Frederick
;
Axisa, Fabrice
;
Vanfleteren, Jan
;
Vandevelde, Bart
;
De Wolf, Ingrid
Journal
Microelectronics International
Abstract
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1880
since deposited on 2021-10-18
Acq. date: 2025-10-27
Citations
Metrics
Views
1880
since deposited on 2021-10-18
Acq. date: 2025-10-27
Citations