Design and analysis of a novel fine pitch and highly stretchable interconnect

dc.contributor.author	Hsu, Yung-Yu
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Bossuyt, Frederick
dc.contributor.author	Axisa, Fabrice
dc.contributor.author	Vanfleteren, Jan
dc.contributor.author	Vandevelde, Bart
dc.contributor.author	De Wolf, Ingrid
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Bossuyt, Frederick
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.orcidimec	Bossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned	2021-10-18T17:12:19Z
dc.date.available	2021-10-18T17:12:19Z
dc.date.issued	2010
dc.identifier.issn	1356-5362
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/17286
dc.source.beginpage	33
dc.source.endpage	38
dc.source.issue	1
dc.source.journal	Microelectronics International
dc.source.volume	27
dc.title	Design and analysis of a novel fine pitch and highly stretchable interconnect
dc.type	Journal article
dspace.entity.type	Publication
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