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Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorCoenen, Jens
dc.contributor.authorJourdain, Anne
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorStucchi, Michele
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-18T17:16:20Z
dc.date.available2021-10-18T17:16:20Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17299
dc.sourceIIOimport
dc.titleEnabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias
dc.typeProceedings paper
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.source.peerreviewyes
dc.source.beginpage1083
dc.source.endpage1087
dc.source.conferenceIEEE 60th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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