Wafer bonding challenges for 3-D integration
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Swinnen, Bart | |
dc.date.accessioned | 2021-10-18T17:25:22Z | |
dc.date.available | 2021-10-18T17:25:22Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17328 | |
dc.source | IIOimport | |
dc.title | Wafer bonding challenges for 3-D integration | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.conference | Semi Sematech Workshop | |
dc.source.conferencedate | 1/07/2010 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - open access |