dc.contributor.author | Katti, Guruprasad | |
dc.contributor.author | Mercha, Abdelkarim | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Van Olmen, Jan | |
dc.contributor.author | Huyghebaert, Cedric | |
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Rakowski, Michal | |
dc.contributor.author | Debusschere, Ingrid | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Dehaene, Wim | |
dc.contributor.author | De Meyer, Kristin | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Biesemans, Serge | |
dc.contributor.author | Swinnen, Bart | |
dc.date.accessioned | 2021-10-18T17:33:03Z | |
dc.date.available | 2021-10-18T17:33:03Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17353 | |
dc.source | IIOimport | |
dc.title | Temperature dependent electrical characteristics of through-si-via (TSV) interconnections | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Mercha, Abdelkarim | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Van Olmen, Jan | |
dc.contributor.imecauthor | Huyghebaert, Cedric | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Rakowski, Michal | |
dc.contributor.imecauthor | Debusschere, Ingrid | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Dehaene, Wim | |
dc.contributor.imecauthor | De Meyer, Kristin | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Biesemans, Serge | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.orcidimec | Mercha, Abdelkarim::0000-0002-2174-6958 | |
dc.contributor.orcidimec | Huyghebaert, Cedric::0000-0001-6043-7130 | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.conference | IEEE International Interconnect Technology Conference - IITC | |
dc.source.conferencedate | 6/06/2010 | |
dc.source.conferencelocation | Burlingame, CA USA | |
imec.availability | Published - imec | |