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Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
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Authors
Labie, Riet
;
Limaye, Paresh
;
Lee, K.W.
;
Berry, C.J.
;
Beyne, Eric
;
De Wolf, Ingrid
Conference
Electronics System Integration Technology Conference - ESTC
Title
Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
Publication type
Proceedings paper
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