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Heterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding

dc.contributor.authorLamponi, M.
dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorPommereau, F.
dc.contributor.authorBrenot, R.
dc.contributor.authorde Valicourt, G.
dc.contributor.authorLelarge, F.
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorMessaoudene, S.
dc.contributor.authorFedeli, J.M.
dc.contributor.authorDuan, G.H.
dc.date.accessioned2021-10-18T17:57:00Z
dc.date.available2021-10-18T17:57:00Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17427
dc.sourceIIOimport
dc.titleHeterogeneously integrated InP/SOI laser using double tapered single-mode waveguides through adhesive die to wafer bonding
dc.typeProceedings paper
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage22
dc.source.endpage24
dc.source.conference7th IEEE International Conference on Group IV Photonics
dc.source.conferencedate1/09/2010
dc.source.conferencelocationBeijing China
imec.availabilityPublished - open access


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