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Characterization and removal of post-etch residues in interconnect patterning

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorConard, Thierry
dc.contributor.authorLux, Marcel
dc.contributor.authorVereecke, Guy
dc.date.accessioned2021-10-18T18:07:10Z
dc.date.available2021-10-18T18:07:10Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17461
dc.sourceIIOimport
dc.titleCharacterization and removal of post-etch residues in interconnect patterning
dc.typeMeeting abstract
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.source.peerreviewno
dc.source.conference3rd International Workshop on Plasma Etch and Strip in Microelectronics - PESM
dc.source.conferencedate3/03/2010
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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