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Backside illuminated AlGaN-on-Si UV detectors integrated by high density flip-chip bonding

dc.contributor.authorMalinowski, Pawel
dc.contributor.authorDuboz, Jean-Yves
dc.contributor.authorDe Moor, Piet
dc.contributor.authorJohn, Joachim
dc.contributor.authorMinoglou, Kiki
dc.contributor.authorSrivastava, Puneet
dc.contributor.authorAbdul, Hameed
dc.contributor.authorPatel, Manojkumar
dc.contributor.authorOsman, Haris
dc.contributor.authorSemond, Fabrice
dc.contributor.authorFrayssinet, Eric
dc.contributor.authorHochedez, Jean-Francois
dc.contributor.authorGiordanengo, Boris
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorMertens, Robert
dc.date.accessioned2021-10-18T18:41:01Z
dc.date.available2021-10-18T18:41:01Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17558
dc.sourceIIOimport
dc.titleBackside illuminated AlGaN-on-Si UV detectors integrated by high density flip-chip bonding
dc.typeOral presentation
dc.contributor.imecauthorMalinowski, Pawel
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorOsman, Haris
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorMertens, Robert
dc.contributor.orcidimecMalinowski, Pawel::0000-0002-2934-470X
dc.source.peerreviewno
dc.source.conferenceInternational Workshop on Nitride Semiconductors - IWN
dc.source.conferencedate19/09/2010
dc.source.conferencelocationTampa, FL USA
imec.availabilityPublished - imec


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