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Verifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions

dc.contributor.authorMarchal, Pol
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorLimaye, Paresh
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorCherman, Vladimir
dc.contributor.authorOprins, Herman
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T18:45:27Z
dc.date.available2021-10-18T18:45:27Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17570
dc.sourceIIOimport
dc.titleVerifying thermal/thermo-mechanical behavior of a 3D stack – challenges and solutions
dc.typeProceedings paper
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.source.peerreviewno
dc.source.beginpage15
dc.source.endpage16
dc.source.conferenceInternational Symposium on VLSI Design Automation and Test - VLSI-DAT
dc.source.conferencedate26/04/2010
dc.source.conferencelocationHsinchu Taiwan
imec.availabilityPublished - imec


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