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Testing TSV-based three-dimensional stacked ICs

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-18T18:48:53Z
dc.date.available2021-10-18T18:48:53Z
dc.date.issued2010-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17579
dc.sourceIIOimport
dc.titleTesting TSV-based three-dimensional stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1689
dc.source.endpage1694
dc.source.conferenceDesign, Automation, and Test in Europe Conference - DATE
dc.source.conferencedate9/03/2010
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5457087
imec.availabilityPublished - open access


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