A structured and scalable test access architecture for TSV-based 3D stacked ICs

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Authors
Marinissen, Erik Jan; Verbree, Jouke; Konijnenburg, Mario
Conference
28th IEEE VLSI Test Symposium - VTS
Title
A structured and scalable test access architecture for TSV-based 3D stacked ICs
Publication type
Proceedings paper
Embargo date
9999-12-31
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