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Conference contributions
A structured and scalable test access architecture for TSV-based 3D stacked ICs
Publication:
A structured and scalable test access architecture for TSV-based 3D stacked ICs
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Date
2010-04
Proceedings Paper
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20358.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
Verbree, Jouke
;
Konijnenburg, Mario
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Abstract
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1866
since deposited on 2021-10-18
Acq. date: 2025-12-14
Citations
Metrics
Views
1866
since deposited on 2021-10-18
Acq. date: 2025-12-14
Citations