Authors

Minas, Nikolaos; Van der Plas, Geert; Oprins, Herman; Yang, Yu; Okoro, Chukwudi; Mercha, Abdelkarim; Torregiani, Cristina; Perry, Dan; Marchal, Pol; Rakowski, Michal; Cherman, Vladimir

Conference

23rd IEEE International Conference on Microelectronic Test Structures - ICMTS

Title

Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design

Publication type

Proceedings paper