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Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'

dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoggen, Jean
dc.contributor.authorVan Puymbroeck, Jan
dc.contributor.authorHeerman, M.
dc.date.accessioned2021-09-30T07:59:49Z
dc.date.available2021-09-30T07:59:49Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1766
dc.sourceIIOimport
dc.titleThermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Puymbroeck, Jan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage339
dc.source.endpage348
dc.source.conferenceThermal Management of Electronic Systems II. Proceedings of EUROTHERM Seminar No 45
dc.source.conferencedate20/09/1995
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


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