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Tailoring copper island density for copper plating on a RuTa substrate

dc.contributor.authorNagar, Magi
dc.contributor.authorVereecken, Philippe
dc.contributor.authorRadisic, Alex
dc.contributor.authorStrubbe, Katrien
dc.date.accessioned2021-10-18T19:28:24Z
dc.date.available2021-10-18T19:28:24Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17680
dc.sourceIIOimport
dc.titleTailoring copper island density for copper plating on a RuTa substrate
dc.typeProceedings paper
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage9
dc.source.endpage16
dc.source.conferenceElectrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)
dc.source.conferencedate24/04/2010
dc.source.conferencelocationVancouver Canada
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 28, Iss. 29


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