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Experimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method

dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandevelde, Bart
dc.contributor.authorRoggen, Jean
dc.contributor.authorMertens, Robert
dc.contributor.authorTemmerman, W.
dc.contributor.authorNelemans, W.
dc.contributor.authorLauwers, E.
dc.contributor.authorAllaert, K.
dc.date.accessioned2021-09-30T08:00:06Z
dc.date.available2021-09-30T08:00:06Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1768
dc.sourceIIOimport
dc.titleExperimental thermal characterisation of electronic components by means of the submerged double jet impingement (SDJI) method
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorMertens, Robert
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage254
dc.source.endpage259
dc.source.conferenceInternational Systems Packaging Symposium - ISPS
dc.source.conferencedate2/12/1997
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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