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Optimization methods for post-bond die-internal/external testing in 3D stacked ICs

dc.contributor.authorNoia, Brandon
dc.contributor.authorChakrabarty, Krishnendu
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-18T19:38:49Z
dc.date.available2021-10-18T19:38:49Z
dc.date.issued2010-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17705
dc.sourceIIOimport
dc.titleOptimization methods for post-bond die-internal/external testing in 3D stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage10
dc.source.conferenceIEEE International Test Conference - ITC
dc.source.conferencedate31/10/2010
dc.source.conferencelocationAustin, TX USA
imec.availabilityPublished - imec


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