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Insertion bonding: A novel Cu-Cu bonding approach for 3D integration

dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVandepitte, Dirk
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T19:47:57Z
dc.date.available2021-10-18T19:47:57Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17728
dc.sourceIIOimport
dc.titleInsertion bonding: A novel Cu-Cu bonding approach for 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage1370
dc.source.endpage1375
dc.source.conferenceIEEE 60th Electronics Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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