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Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorVanstreels, Kris
dc.contributor.authorLabie, Riet
dc.contributor.authorLuhn, Ole
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.authorVandepitte, Dirk
dc.date.accessioned2021-10-18T19:48:47Z
dc.date.available2021-10-18T19:48:47Z
dc.date.issued2010
dc.identifier.issn0960-1317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17730
dc.sourceIIOimport
dc.titleInfluence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
dc.typeJournal article
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage45032
dc.source.journalJournal of Micromechanics and Microengineering
dc.source.issue4
dc.source.volume20
imec.availabilityPublished - imec


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