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Fabrication and testing of a wafer-level chip encapsulation method for implantable devices

dc.contributor.authorOp de Beeck, Maaike
dc.date.accessioned2021-10-18T19:51:04Z
dc.date.available2021-10-18T19:51:04Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17736
dc.sourceIIOimport
dc.titleFabrication and testing of a wafer-level chip encapsulation method for implantable devices
dc.typeOral presentation
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.source.peerreviewno
dc.source.conferenceIMAPS Autumn Event
dc.source.conferencedate25/11/2010
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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