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Metal-bonded, hermetic 0-level package for MEMS

dc.contributor.authorPham, Nga
dc.contributor.authorLimaye, Paresh
dc.contributor.authorCzarnecki, Piotr
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCherman, Vladimir
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-18T20:18:15Z
dc.date.available2021-10-18T20:18:15Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17804
dc.sourceIIOimport
dc.titleMetal-bonded, hermetic 0-level package for MEMS
dc.typeProceedings paper
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorCzarnecki, Piotr
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage6
dc.source.conferenceElectronics Packaging Technology Conference - EPTC
dc.source.conferencedate8/12/2010
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


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