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Through-Silicon Via technology for 3D applications

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorLuhn, Ole
dc.contributor.authorCivale, Yann
dc.contributor.authorWang, Yu-Shuen
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T20:19:20Z
dc.date.available2021-10-18T20:19:20Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17807
dc.sourceIIOimport
dc.titleThrough-Silicon Via technology for 3D applications
dc.typeProceedings paper
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage97
dc.source.endpage107
dc.source.conferenceProcessing, Materials, and Integration of Damascene and 3D Interconnects
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 25, Issue 38


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