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Electrodeposition for 3D integration

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorRadisic, Alex
dc.contributor.authorLuhn, Ole
dc.contributor.authorCivale, Yann
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorRodet, Simon
dc.contributor.authorHonore, Mia
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-18T20:19:47Z
dc.date.available2021-10-18T20:19:47Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17808
dc.sourceIIOimport
dc.titleElectrodeposition for 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.source.peerreviewyes
dc.source.beginpage31
dc.source.endpage36
dc.source.conferenceSymposium " Galvanik " Eine etablierte Technik innovativ angewendet
dc.source.conferencedate25/11/2010
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec
imec.internalnoteshttp://www.ikts.fraunhofer.de/veranstaltungen/GalvanikProgramm.jsp


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