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Via last using polymer liners and their reliability

dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorCivale, Yann
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T21:06:09Z
dc.date.available2021-10-18T21:06:09Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17921
dc.sourceIIOimport
dc.titleVia last using polymer liners and their reliability
dc.typeProceedings paper
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceIMAPS 3D 6th International Conference and Exhibition on Device Packaging
dc.source.conferencedate8/03/2010
dc.source.conferencelocationPhoenix, AZ USA
imec.availabilityPublished - imec


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