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Use of polymer liners for 3D-WLP TSVs: process, reliability and cost

dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorCivale, Yann
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T21:07:01Z
dc.date.available2021-10-18T21:07:01Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17923
dc.sourceIIOimport
dc.titleUse of polymer liners for 3D-WLP TSVs: process, reliability and cost
dc.typeProceedings paper
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage41
dc.source.endpage54
dc.source.conferenceProcessing, Materials, and Integration of Damascene and 3D Interconnects
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 33, Iss. 12


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