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Poly-silicon wet removal for replacement gate integration scheme: impact of process parameters on the removal rate

dc.contributor.authorSebaai, Farid
dc.contributor.authorVeloso, Anabela
dc.contributor.authorClaes, Martine
dc.contributor.authorDevriendt, Katia
dc.contributor.authorAbsil, Philippe
dc.contributor.authorMertens, Paul
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-18T21:24:24Z
dc.date.available2021-10-18T21:24:24Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17964
dc.sourceIIOimport
dc.titlePoly-silicon wet removal for replacement gate integration scheme: impact of process parameters on the removal rate
dc.typeMeeting abstract
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewno
dc.source.beginpage133
dc.source.endpage134
dc.source.conference10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS
dc.source.conferencedate19/09/2010
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - imec


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