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Spacer defined double patterning for 20nm half pitch interconnect damascene structures

dc.contributor.authorSiew, Yong Kong
dc.contributor.authorCockburn, Andrew
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVersluijs, Janko
dc.contributor.authorKunnen, Eddy
dc.contributor.authorDekkers, Harold
dc.contributor.authorVolders, Henny
dc.contributor.authorCiofi, Ivan
dc.contributor.authorGravey, Virginie
dc.contributor.authorNoori, Atif
dc.contributor.authorPadhi, Deenesh
dc.contributor.authorShah, Kavita
dc.date.accessioned2021-10-18T21:32:59Z
dc.date.available2021-10-18T21:32:59Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17983
dc.sourceIIOimport
dc.titleSpacer defined double patterning for 20nm half pitch interconnect damascene structures
dc.typeOral presentation
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.source.peerreviewno
dc.source.conferenceApplied Materials Engineering Technology Conference
dc.source.conferencedate15/06/2010
dc.source.conferencelocationTreviso Italy
imec.availabilityPublished - imec


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