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dc.contributor.authorSiew, Yong Kong
dc.contributor.authorVersluijs, Janko
dc.contributor.authorKunnen, Eddy
dc.contributor.authorCiofi, Ivan
dc.contributor.authorAlaerts, Wilfried
dc.contributor.authorDekkers, Harold
dc.contributor.authorVolders, Henny
dc.contributor.authorSuhard, Samuel
dc.contributor.authorCockburn, Andrew
dc.contributor.authorSleeckx, Erik
dc.contributor.authorVan Besien, Els
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorNoori, Atif
dc.contributor.authorPadhi, Deenesh
dc.contributor.authorShah, Kavita
dc.contributor.authorGravey, Virginie
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-18T21:33:34Z
dc.date.available2021-10-18T21:33:34Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17984
dc.sourceIIOimport
dc.titleIntegration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)
dc.typeProceedings paper
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorAlaerts, Wilfried
dc.contributor.imecauthorDekkers, Harold
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecDekkers, Harold::0000-0003-4778-5709
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.source.peerreviewyes
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate7/06/2010
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


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