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Analysis of the performance of a micromechanical test structure to measure stress in thick electroplated metal films

dc.contributor.authorSmith, S.
dc.contributor.authorBrockie, N. L.
dc.contributor.authorMurray, J.
dc.contributor.authorWilson, Chris
dc.contributor.authorHorsfall, A. B.
dc.contributor.authorTerry, J. G.
dc.contributor.authorStevenson, J. T. M.
dc.contributor.authorMount, A. R.
dc.contributor.authorWalton, A. J.
dc.date.accessioned2021-10-18T21:43:26Z
dc.date.available2021-10-18T21:43:26Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18005
dc.sourceIIOimport
dc.titleAnalysis of the performance of a micromechanical test structure to measure stress in thick electroplated metal films
dc.typeProceedings paper
dc.contributor.imecauthorWilson, Chris
dc.source.peerreviewno
dc.source.beginpage80
dc.source.endpage85
dc.source.conferenceIEEE International Conference on Microelectronic Test Structures - ICMTS
dc.source.conferencedate23/03/2010
dc.source.conferencelocationHiroshima Japan
imec.availabilityPublished - imec


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