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Thermal modeling and experimental validation of thermal effects of 3D-ICs
Publication:
Thermal modeling and experimental validation of thermal effects of 3D-ICs
Date
2010
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Srinivasan, Adi
;
Cheng, Edmund
;
Oprins, Herman
;
Van der Plas, Geert
Journal
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1881
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Metrics
Views
1881
since deposited on 2021-10-18
422
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations