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Die-to-die adhesive bonding for evanescently-coupled photonic devices
Publication:
Die-to-die adhesive bonding for evanescently-coupled photonic devices
Date
2010
Meeting abstract
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21759.pdf
285.59 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stankovic, Stevan
;
Van Thourhout, Dries
;
Roelkens, Gunther
;
Jones, R.
;
Heck, J.
;
Sysak, M.
Journal
Abstract
Description
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1867
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Metrics
Views
1867
since deposited on 2021-10-18
405
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations