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Die-to-die adhesive bonding for evanescently-coupled photonic devices

dc.contributor.authorStankovic, Stevan
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorJones, Richard
dc.contributor.authorHeck, John
dc.contributor.authorSysak, Matthew
dc.date.accessioned2021-10-18T21:58:24Z
dc.date.available2021-10-18T21:58:24Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18038
dc.sourceIIOimport
dc.titleDie-to-die adhesive bonding for evanescently-coupled photonic devices
dc.typeProceedings paper
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage411
dc.source.endpage420
dc.source.conferenceSemiconductor Wafer Bonding 11: Science, Technology, and Applications
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 33, Iss. 4


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