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Dependence of etching rate on aspect ratio for high aspect TSV etching

dc.contributor.authorTaichi, Nishio
dc.contributor.authorAoi, Nobuo
dc.contributor.authorSasago, Masaru
dc.contributor.authorKubota, Masafumi
dc.contributor.authorKostermans, Maarten
dc.contributor.authorBrouri, Mohand
dc.contributor.authorDupont, Tania
dc.date.accessioned2021-10-18T22:08:59Z
dc.date.available2021-10-18T22:08:59Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18061
dc.sourceIIOimport
dc.titleDependence of etching rate on aspect ratio for high aspect TSV etching
dc.typeProceedings paper
dc.contributor.imecauthorDupont, Tania
dc.source.peerreviewno
dc.source.beginpage116
dc.source.conferenceJSAP the 71st Autumn Meeting
dc.source.conferencedate14/09/2010
dc.source.conferencelocationNagasaki Japan
dc.identifier.urlhttps://secure1.gakkai-web.net/gakkai/jsap_pro/english/pro/bunrui13.html#15p_P8
imec.availabilityPublished - imec


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